Preface
Biographies
PART I-INTRODUCTION
Historical Background
Why Use Gold?
PART 2-ELECTROLYTES
Introduction to Electrolytes
Alkaline Cyanide electrolytes
Neutral Electrolytes
Acid Electrolytes
Non-Cyanide Electrolytes
Electrolyte Parameters
Throwing and Levelling Power
Immersion Solutions
Electroless Solutions
PART 3-TECHNIQUES
Pretreatment
Vat Plating
Barrel Plating
Aerosol Deposition
Brush Plating
Miscellaneous Techniques
Turbo Jet
Selective Plating
Post- Treatment
PART 4-PROPERTIES
Soft Soldering
Weldability
Wear, Friction and Lubrication
Contact Properties
Porosity
Density
PART 5-TESTING
Solderability
contact resistance
Porosity
Thickness
Hardness
Stress
Ductility
Adhesion
Analysis
Quality Control
PART 6-APPLICATIONS
Printed Circuits
Connectors
Semiconductors and Microelectronic Devices
reed switches
Space Applications
electroforming and heavy deposits
Decorative Plating
Watchcase Manufacture
Appendix Specifications
Index
